• Rework Pad for BGA PCB Repair (Phones IC)
  • Rework Pad for BGA PCB Repair (Phones IC)
  • Rework Pad for BGA PCB Repair (Phones IC)
  • Rework Pad for BGA PCB Repair (Phones IC)
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Rework Pad for BGA PCB Repair (Phones IC)

Rework Pad for BGA PCB Repair (Phones IC)

$35.00 NZD
$55.00 NZD $35.00 NZD
SALE SOLD OUT

Includes: - Rework Pad for BGA PCB Repair (Phones IC)

Fits Models: - Universal / check fitment before purchase

Model Years: - Check fitment before purchase

Submodels: - Applies to listed models

Engine Options: - Compatible with standard engine options

Description: The Rework Pad for BGA PCB Repair is designed for efficient and precise reworking of Ball Grid Array (BGA) components on printed circuit boards (PCBs) commonly found in mobile phones. This pad provides a stable surface for heating and soldering, ensuring optimal performance during repairs.

Features: - High-temperature resistance for safe soldering - Non-stick surface for easy component removal - Durable material for repeated use - Ideal for BGA rework in mobile devices - Compact size for easy handling and storage

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