XG-50 BGA CPU LED Solder Tin Paste Sn63/Pb37 for (25-45um)

Includes: - XG-50 BGA CPU LED Solder Tin Paste Sn63/Pb37

Fits Models: - Universal / check fitment before purchase

Model Years: - Check fitment before purchase

Submodels: - Applies to listed models

Engine Options: - Compatible with standard engine options

Description: The XG-50 BGA CPU LED Solder Tin Paste Sn63/Pb37 is a high-quality solder paste designed for various electronic applications, particularly in the assembly of BGA (Ball Grid Array) and LED components. This solder paste features a blend of tin and lead, providing excellent wetting properties and reliable connections for electronic circuits.

Features: - Ideal for BGA and LED soldering applications - Composition: Sn63/Pb37 for optimal performance - Particle size range: 25-45um for precision application - Ensures strong, durable solder joints - Suitable for a variety of electronic devices and components